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Scribing Equipment Product List

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Multi-Head Scriber / MM Series

Achieve increased productivity with a multi-head type that is optimal for mass production of small applications.

Through automatic calculation, each head is driven at the shortest takt time, and it is possible to set separation conditions for each individual head. We propose cutting solutions based on the number of mounted heads for a diverse range of applications. ≪Basic Specifications≫ ■ Supported substrate thickness   Single board 0.4mm-1.1mm   Laminated board 0.8mm-2.2mm ■ Scribing speed   500mm/sec MAX ■ Scribing accuracy   Straight line ±40µm

  • Glass
  • Touch Panel
  • Scribing Equipment

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Scribe device wafer substrate processing

High speed, high quality! This is a semi-automatic scriber compatible with 4-inch wafers.

This is a semi-automatic scribing device compatible with 4-inch wafers, featuring independent processing axis, feed axis, and camera axis. Unlike spring-based systems, it is not affected by the depth of the cut, allowing for a constant load, and the air suspension effect significantly reduces tool jumping. Additionally, to minimize vibrations on the drive side, it is equipped with a linear servo motor, enabling more precise scribing. 【Features】 ■ High rigidity design and high throughput ■ Auto-alignment function ■ Tool pressure control via air ■ Equipped with linear servo motor *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Scribing Equipment

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Scribe device, sapphire, GaAs, GaN, InP, ceramic

High-speed, high-quality! Semi-automatic scriber compatible with 4-inch wafers!

This is a semi-automatic scriber device compatible with 4-inch wafers, where the processing axis, feed axis, and camera axis are each independent. Unlike spring-based systems, it is not affected by the depth of the cut, allowing for a constant load, and the air suspension effect significantly reduces tool jumping. Additionally, to minimize vibrations on the drive side, it is equipped with a linear servo motor, enabling more precise scribing. 【Features】 ■ High rigidity design and high throughput ■ Auto-alignment function ■ Tool pressure control via air ■ Equipped with a linear servo motor * For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Scribing Equipment

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Scribe device, semiconductor, LED

High-speed, high-quality! Semi-auto scriber compatible with 4-inch wafers.

This is a semi-automatic scriber device compatible with 4-inch wafers, where the processing axis, feed axis, and camera axis are each independent. Unlike spring-based systems, it is not affected by the depth of the cut, allowing for a constant load, and the air suspension effect significantly reduces tool jumping. Additionally, to minimize vibrations on the drive side, it is equipped with a linear servo motor, enabling more precise scribing. 【Features】 ■ High rigidity design and high throughput ■ Auto-alignment function ■ Tool pressure control via air ■ Equipped with a linear servo motor *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Scribing Equipment

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Scribe device semiconductor LED

High-speed, high-quality! Semi-auto scriber compatible with 4-inch wafers!

This is a semi-automatic scribing device compatible with 4-inch wafers, where the processing axis, feed axis, and camera axis are each independent. Unlike spring-based systems, it is not affected by the depth of the cut, allowing for a constant load, and the air suspension effect significantly reduces tool jumping. Additionally, to minimize vibrations on the drive side, it is equipped with a linear servo motor, enabling more precise scribing. 【Features】 ■ High rigidity design and high throughput ■ Auto-alignment function ■ Tool pressure control via air ■ Equipped with a linear servo motor *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines
  • Scribing Equipment

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